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Supermicro BigTwin SuperServer 2028BT-HNR+ (Complete System Only)
6 Hot-swap 2.5" NVMe Drive Bays per Node


Supermicro SuperServer 2028BT-HNR+ (Complete System Only)

Supermicro BigTwin Products
Supermicro SuperServer
Supermicro SuperServer 2028BT-HNR+ - BigTwin 6 Hot-swap 2.5" NVMe per Node
#SYS-2028BT-HNR+
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Overview:

Due to the complexity of integration, this product is sold as a completely assembled system only (with minimum 2 CPUs, 2 DIMMs, 1 NVMe and 1 SIOM card per node).

Key Features

  • Compute Intensive Application
  • HPC, Data Center
  • Enterprise Server
  • Financial Analysis
  • Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  • Dual socket R3 (LGA 2011) supports Intel Xeon processor E5-2600 v4/ v3 family; QPI up to 9.6GT/s
  • Up to 3TB ECC 3DS LRDIMM , up to DDR4- 2400MHz ; 24 DIMM slots
  • 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking)
    Note: must bundle with Network card
  • IPMI 2.0 + KVM with dedicated LAN
  • 6 Hot-swap 2.5" NVMe drive bays
  • Video via Aspeed AST2400 BMC
  • 4 Heavy duty 8cm PWM fans with air shroud
  • 2200W Redundant Power Supplies Titanium Level (96%)
  • 2 M.2 Cards support

NVM Express, X10, Intel Xeon Platinum, 80 Plus Titanium, 96 Titanium

Supermicro BigTwin - The Industry's Highest Performing Twin Mult-Node System

The Supermicro BigTwin is the first and only 2U multi-node system supporting the highest performance processor, memory, storage, I/O and an incredible 30% better thermal capacity. The 5th generation of Supermicro's Twin architecture is fully optimized for today's diverse workloads and architected for further technology breakthroughs.

  • No-compromise 5th Generation Twin architecture delivers the highest performance and efficiency in a 2U 4-node platform.
  • The first and only multi-node system that supports the widest TDP range of CPUs (up to 205 watts), fully exploits all memory channels with 24 DIMMs per node and 24 AllFlash NVMe drives.
  • 30% better thermal capacity in a compact 2U form factor enables configurations with the highest performance processor, memory, storage and I/O leveraging the Titanium level 96% efficient PowerStick power supplies (2200W/2600W)
  • 100% more I/O capacity and added flexibility with more than 10 networking options including 1GbE, 10G, 25G, 100G, IB and industry leading SIOM modular interconnect.
  • Each node can support current and next generation dual Intel Xeon processors with up to 3TB of memory, 24 drives of All-Flash NVMe, Hybrid NVMe/SATA/SAS, SSD and HDD, plus 2 m.2 NVMe/SATA per node.

Features:

The 5th Generation Twin Architecture

The Supermicro BigTwin is a breakthrough modular multi-node server system that eliminates traditional modular vs rack computing design trade-offs.  BigTwin is the 5th generation in the patented Supermicro Twin Family with a multitude of innovations and engineering breakthroughs.  The no-compromise architecture delivers the efficiency of multi-node density optimized systems with the full features and power of traditional 1U and 2U rack mount systems.

Rear View of 2U BigTwin Server System Showing 4 Hot-swap DP Nodes and 2 Redundant Power Supplies
Rear View of 2U BigTwin Server System Showing 4 Hot-swap DP Nodes and 2 Redundant Power Supplies

A No-Compromise Design

The key benefit of BigTwin is the no-compromise design.  Historically multi-node systems traded off features and capacity for higher density.  They were deployed for workloads that did not require the highest performance or the highest memory density on a single node. The new 2U BigTwin design is a breakthrough multi-node system that supports the highest performing CPUs, full 24 DIMMs of memory and up to 24 all-flash NVMe SSD drives.

Front View of 2U BigTwin Server System (All-Flash NVMe Model)
Front View of 2U BigTwin Server System (All-Flash NVMe Model)


All-Flash NVME and 24 DIMMs Per Node

Supermicro has been a leader in introducing NVMe support and advanced NVMe features in our product portfolio and BigTwin continues that tradition.  BigTwin supports 24 hotswappable 2.5” U.2 NVMe drives, or mixed configurations with SAS3 and SATA3 drives (varies by different BigTwin models). 

Leveraging Supermicro’s building block architecture BigTwin is a shared design with common components where most multi-node systems are one-off designs with limited leverage and integration to the rest of the product family creating sub-optimal service, sparing and training. The building block design also allows the system to be optimized to the specific requirements of the intended workload.

The 24 DIMMs can be used to deliver better performance and responsiveness for database and cloud infrastructure workloads, as well as providing the flexibility to customers looking to invest in lower capacity DIMMs for lowered dollar per GB solutions.

Maximum Memory Support Per Node on 3 Different 2U Twin Architecture Generations
Maximum Memory Support Per Node on 3 Different 2U Twin Architecture Generations

Each BigTwin Server Supports up to

  • 4 hot-swappable DP nodes in 2U
  • 24 DIMMs per node
  • 6 NVMe / SAS / SATA drives per node
  • 1 SIOM card support per node
  • 2 low-profile PCI-E x16 slots per node
  • Redundant 2200W Titanium Level (96%) Power Supplies

Applications

A hyper-converged solution of 3 nodes plus a hot spare can be hosted by just one BigTwin server. Each node can support dual Intel Xeon E5-2600 v4/v3 processors with up to 3TB of memory, 2 NVMe SSD drives for caching and 4 SAS drives for datastore.

The Supermicro BigTwin is a breakthrough modular multi-node server system, an ultradense and energy efficient powerhouse that provides industry leading performance perwatt, per-dollar, and per-squarefoot.

BigTwin’s 96% Efficiency 2200W Power Stick Design
BigTwin’s 96% Efficiency 2200W Power Stick Design

SIOM: Supermicro Optimized Flexible Networking for 1GB/s to 100GB/s

Supermicro Super I/O Module (SIOM), common across both Rack and Modular platforms, delivers up to 50% I/O cost savings and freedom to select networking options from 1Gb/s to 100Gb/s. The SIOM enables a tighter system integration and leaves a total of two PCI-E 3.0 x16 LP slots for storage or networking add-on-cards on each node.

Example SIOM options
Example SIOM options

SIOM Modules Networking Features
AOC-MH25G-m2S2T Dual-port 25 Gigabit Ethernet SFP28 and Dual-port 10 Gigabit Ethernet RJ45
AOC-MHIBF-m2Q2G Dual-port FDR InfiniBand QSFP+ and Dual-port Gigabit Ethernet RJ45
AOC-MTG-i4S Quad-port 10 Gigabit Ethernet SFP+
AOC-MGP-i4 Quad-port Gigabit Ethernet RJ45

Specifications:


SuperServer 2028BT-HNR+ (Black) Specifications
Motherboard Super X10DRT-B+
Processor/Cache (per Node)
CPU
  • Dual Socket P (LGA 3647) Intel Xeon processor E5-2600 v4/ v3 family (up to 145W TDP) *
  • Dual Socket R3 (LGA 2011)
Cores / Cache Up to 22 Cores / Up to 55MB Cache
System Bus QPI up to 9.6 GT/s
Note  BIOS version 2.0 or above is required
* Please contact Supermicro Technical Support for additional information about frequency optimized CPUs and specialized system optimization.
System Memory (per Node)
Memory Capacity
  • 24x 288-pin DDR4 DIMM slots
  • Up to 3TB ECC 3DS LRDIMM, 768GB ECC RDIMM
Memory Type 2400/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
DIMM Sizes
  • RDIMM: 32GB, 16GB, 8GB, 4GB
  • LRDIMM: 64GB, 32GB
  • 3DS LRDIMM: 128GB
Memory Voltage 1.2 V
Error Detection Corrects single-bit errors
On-Board Devices
Chipset Intel C621 chipset
SAS SAS3 (12Gbps) via Broadcom 3008; IT mode
Network Must bundle with at least one SIOM network card
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • ASPEED AST2400 BMC
Video ASPEED AST2400 BMC
Input / Output (per Node)
LAN 1 RJ45 Dedicated IPMI LAN port
USB 2 USB 3.0 ports (rear)
Video 1 VGA port
Others M.2 and SATA DOM for boot drive only
Chassis
Form Factor 2U Rackmount
Model CSE-217BHQ+-R2K22BP2
Dimensions and Weight
Width 17.6" (447mm)
Height 3.47" (88mm)
Depth 28.75" (730mm)
Package 9.76" (H) x 24.65" (W) x 45.28" (D)
Weight
  • Gross Weight: 85 lbs (38.6kg)
  • Net Weight: 54.5 lbs (24.7 kg)
Available Colors Black
Front Panel
Buttons
  • Power On/Off button
  • UID button
LEDs
  • Power status LED
  • HDD activity LED
  • 2 Network activity LEDs
  • Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express
  • 2 PCI-E 3.0 (x16) Low-profile slots
  • 1 SIOM card (must bundle with network card)
Drive Bays / Storage (per Node)
Hot-swap 6 Hot-swap 2.5" NVMe drive bays
System Cooling
Fans 4 Heavy duty 8cm PWM fans with air shroud
Power Supply
Power 2200W Redundant Power Supplies with PMBus
Total Output Power 1200W/1800W/1980W/2090/2200W
Dimension (W x H x L) 45 x 40 x 480 mm
Input
  • 1200W: 100-127Vac / 50-60Hz
  • 1800W: 200-220Vac / 50-60Hz
  • 1980W: 220-230Vac / 50-60Hz
  • 2090W: 230-240Vac / 50-60Hz
  • 2090W: 180-220Vac (for UL/cUL only)
  • 2200W: 220-240Vac (for UL/cUL only)
  • 2090W: 230-240Vdc (for CCC only)
+12V
  • Max: 100A / Min: 0A (100-127Vac)
  • Max: 150A / Min: 0A (200-220Vac)
  • Max: 165A / Min: 0A (220-230Vac)
  • Max: 174.17A / Min: 0A (230-240Vac)
  • Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
  • Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
  • Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
12Vsb Max: 2.1A / Min: 0A
Output Type Gold Finger
Certification 9680Plus TitaniumUL/cUL/CB/BSMI/CE/CCC
Titanium Level
[ Cert. in progress ]
System BIOS
BIOS Type 128Mb SPI Flash EEPROM with AMI BIOS
Operating Environment
RoHS RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)

Parts List:


Parts List - (Items Included)
  Part Number Qty Description
Motherboard / Chassis MBD-X10DRT-B+ 4 Super X10DRT-B+ Motherboard
CSE-217BHQ+-R2K22BP 1 2U Chassis
Backplane BPN-ADP-6NVME3-1UB 4 6x NVMe ports and 50A power sourcing daughter card for Big Twin
BPN-NVME3-217BHQ 1 2U 24-Port 4-Node NVMe Backplane Support 6x2.5
Cable 1 CBL-PWCD-0578 2 PWCD,US,IEC60320 C14 TO C13,3FT,14AWG
Drive Tray(s) MCP-220-00127-0B-BULK 24 Black gen3 Hotswap 2.5 NVMe drive tray, Orange tab/Lock/Bulk
Parts MCP-240-21721-0N 1 217B BigTwin type I (Impact) BPN retention bkt w/ foam assy
Air Shroud MCP-310-21706-0B 4 SC217B/827B BigTwin air shroud for X10DRT-B+
Riser Card RSC-P-6 4 RSC-P-6 (1U LHS TwinPro RSC with 1 PCI-Ex16),RoHS
RSC-R1UTP-E16R 4 1U RHS TwinPro Riser card with one PCI-E x16 slot
Heatsink / Retention SNK-P0047PSM 4 1U Passive Front CPU Heat Sink w/ a Middle Air Channel for X9, X10 2U Twin^2+ and Twin Pro^2 Series Servers
SNK-P0057PS 4 1U High Performance Passive CPU Heat Sink for X9, X10 Systems Equipped w/ a Narrow ILM MB
Power Supply PWS-2K22A-1R 2 1U 2200W Redundant Power Supply Titanium, 45(W) X 40(H) X 48(L)
Optional Parts List
  Part Number Qty Description
Carrier Card BPN-ADP-2M2-1UB - Carrier card for NVMe/SATA M.2 SSDs support, connect up to 2 M.2 SSD (up to 22x80 mm length SSDs are supported)
Global Services & Support OS4HR3/2/1 - 3/2/1-year onsite 24x7x4 service
OSNBD3/2/1 - 3/2/1-year onsite NBD service
Software SFT-OOB-LIC 1 OOB Management Package (per node license)
SFT-DCMS-Single 1 DataCenter Management Package (per node license)
SuperDOM - - Supermicro SATA DOM Solutions
Network Card(s) AOC-STG-i2
AOC-SGP-i2
AOC-SGP-i4
AOC-STG-b4S
AOC-STGN-i2S
AOC-STGN-i1S
AOC-STG-i2T
AOC-STG-i4T
AOC-STGF-i2S
AOC-STG-i4S
AOC-STGS-i1T
AOC-STGS-i2T
AOC-S25G-b2S
AOC-S25G-m2S
AOC-S40G-i1Q
AOC-S40G-i2Q
AOC-S100G-m2C
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Standard LP, 2x 10GbE CX4, PCI-E x8, Intel 82598EB
Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350AM2
Standard LP, 4x GbE RJ45, PCI-E x4, Intel i350
Standard LP, 4x 10GbE SFP+, PCI-E x8, Broadcom BCM57840S
Standard LP, 2x 10GbE SFP+, PCI-E x8, Intel 82599ES
Standard LP, 1x 10GbE SFP+, PCI-E x8, Intel 82599EN
Standard LP, 2x 10GbE RJ45, PCI-E x8, Intel X540
Standard LP, 4x 10GbE RJ45, PCI-E x8, Intel XL710 + X557-AT4
Standard LP, 2x 10G SFP+, PCI-E x8, Intel XL710-BM1
Standard LP, 4x 10G SFP+, PCI-E x8, Intel XL710-BM1
Standard LP, 1x 10GbE RJ45, PCI-E x4, Intel X550-AT2
Standard LP, 2x 10GbE RJ45, PCI-E x4, Intel X550-AT2
Standard LP, 2x 25G SFP28, PCI-E x8, Broadcom BCM57414
Standard LP, 2x 25G SFP28, PCI-E x8, Mellanox ConnectX-4 LX EN
Standard LP, 1x 40GbE QSFP+, PCI-E x8, Intel XL710
Standard LP, 2x 40GbE QSFP+, PCI-E x8, Intel XL710
Standard LP, 2x 100GbE QSFP28, PCI-E x16, Mellanox ConnectX-4 EN

Views:

Angled View - System

Angled View - System


Angled View - Node

Angled View - Node


Front View - System

Front View - System


Rear View - System

Rear View - System

Integrated Board:

X10DRT-B+ (For SuperServer Only)

X10DRT-B+ (For SuperServer Only)

Key Features

  • Intel Xeon processor E5-2600 V3, Intel Xeon processor E5-2600 V4, Socket R3 (LGA 2011) supported; QPI up to 9.6GT/s; CPU TDP support Up to 145W
  • Intel C612
  • Up to 3TB 3DS ECC LDIMM, in 24 DIMM slots
  • 1 PCI-E 3.0 x16 Left Riser Slot
    1 PCI-E 3.0 x16 Right Riser Slot
    1 PCI-E 3.0 x24 Proprietary Slot (for Supermicro storage add-on card)
    1 PCI-E 3.0 x16 SIOM LAN Networking Slot 2 PCI-E 3.0 x8 Proprietary Slot (For M.2 add-on card)
  • 1 VGA port
  • Intel C612 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
  • 1 PCI-E 3.0 x16 SIOM LAN Networking Slot
X10DRT-B+ Specifications
Physical Stats
Form Factor Proprietary
Dimensions 18.86" x 7.61" (47.9cm x 19.33cm)
Processor/Cache (per Node)
CPU
  • Intel Xeon processor E5-2600 V3
  • Intel Xeon processor E5-2600 V4
  • Socket R3 (LGA 2011) supported; QPI up to 9.6GT/s; CPU TDP support Up to 145W
System Memory
Memory Capacity Up to 3TB 3DS ECC LDIMM, in 24 DIMM slots
Memory Type 2400/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
DIMM Sizes
  • RDIMM: 8GB, 16GB, 32GB, 64GB
  • LDIMM: 32GB, 64GB
  • 3DS LRDIMM: 128GB
Memory Voltage 1.2V
Error Detection
  • Corrects single-bit errors
  • Detects double-bit errors (using ECC memory)
On-Board Devices
Chipset Intel C612
SATA Intel C612 controller for 6 SATA3 (6 Gbps) ports; RAID 0,1,5,10
Network Controllers 1 PCI-E 3.0 x16 SIOM LAN Networking Slot
Graphics Aspeed AST2400 BMC
Input / Output
USB 2 USB 3.0 ports (2 rear)
Video Output 1 VGA port
TPM 1 TPM 2.0 Header
Expansion Slots
PCI-E
  • 1 PCI-E 3.0 x16 Left Riser Slot
  • 1 PCI-E 3.0 x16 Right Riser Slot
  • 1 PCI-E 3.0 x24 Proprietary Slot (for Supermicro storage add-on card)
  • 1 PCI-E 3.0 x16 SIOM LAN Networking Slot 2 PCI-E 3.0 x8 Proprietary Slot (For M.2 add-on card)
System BIOS
BIOS Type AMI UEFI
BIOS Features UEFI 2.3.1
Management
Software KVM with dedicated LAN, NMI, SPM, SSM, SUM, SuperDoctor 5, Watchdog
PC Health Monitoring
Voltage +1.8V, +12V, +3.3V, +5V, +5V standby, Chassis intrusion header, Monitors CPU voltages, Supports system management utility, System level control
FAN
  • 2x 4-pin fan headers (up to 2 fans)
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitoring for speed control
  • Thermal control tachometer fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • CPU thermal trip support
  • PECI
LED
  • CPU / System Overheat LED
  • Suspend static indicator LED
  • UID/Remote UID
Other Features
  • UID
  • WOL
Operating Environment
Operating Temperature Range 0°C ~ 60°C (32°F ~ 140°F)
Non-Operating Temperature Range -20°C ~ 60°C (-4°F ~ 140°F)
Operating Relative Humidity Range 10% ~ 85% (non-condensing)
Non-Operating Relative Humidity Range 10% ~ 95% (non-condensing)

Videos:

Supermicro SuperMinute: X10 BigTwin

Supermicro introduces its 5th generation Twin architecture the X10 BigTwin. With its no-compromise design, it is the industry’s highest performing 2U multi-node platform.



Supermicro BigTwin Product Loop

Introducing BigTwin, the IT industry’s highest performing twin multi-node system with 4 nodes in 2U supporting the highest performance 205-watt DP Intel Xeon E5-2600 v4/v3 product families, a full 24 DIMMs of memory per node, 24 All-Flash NVMe or hybrid drives, three PCI-E 3.0 x16 I/O options per node, and an industry leading 30% better thermal capacity for maximum performance, efficiency and free air cooling (1.05 PUE). With Supermicro’s 96%+ high-efficiency, fully redundant 2200W, 2600W PowerStick design and advanced thermal architecture.

The BigTwin is optimized for today and future proofed for the next generation of technology breakthroughs advancements, including new generation Intel Skylake processors.



Documentation:

Download the Supermicro BigTwin Datasheet (.PDF)

Pricing Notes:

Supermicro BigTwin Products
Supermicro SuperServer
Supermicro SuperServer 2028BT-HNR+ - BigTwin 6 Hot-swap 2.5" NVMe per Node
#SYS-2028BT-HNR+
Contact us for Pricing!